Abstract
Molecular dynamics simulation is one kinds of important methods to research the nanocrystalline materials which is difficult to be studied through experimental characterization. In order to study the effects of Sn content and strain rate on the mechanical properties of nanopolycrystalline Cu–Sn alloy, the tensile simulation of nanopolycrystalline Cu–Sn alloy was carried out by molecular dynamics in the present study. The results demonstrate that the addition of Sn reduces the ductility of Cu–Sn alloy. However, the elastic modulus and tensile strength of Cu–Sn alloy are improved with increasing the Sn content initially, but they will be reduced when the Sn content exceeds 4% and 8%, respectively. Then, strain rate ranges from 1 × 109 s−1 to 5 × 109 s−1 were applied to the Cu–7Sn alloy, the results show that the strain rate influence elastic modulus of nanopolycrystalline Cu–7Sn alloy weakly, but the tensile strength and ductility enhance obviously with increasing the strain rate. Finally, the microstructure evolution of nanopolycrystalline Cu–Sn alloy during the whole tensile process was studied. It is found that the dislocation density in the Cu–Sn alloy reduces with increasing the Sn content. However, high strain rate leads to stacking faults more easily to generate and high dislocation density in the Cu–7Sn alloy.
Highlights
Chang [21] et al carried out molecular dynamics simulation of Ti nanowires, and the results showed that when the strain rate was higher than 0.01 ps−1, the tensile properties of the nanowires improved rapidly, and the yield point and yield stress both increased with the increase of strain rate
Cu–Sn alloy more intuitively, Figure 6 shows the variation of elastic modulus and tensile strength with different strain rates
8 ofare the ratio of lattice changes rapidly and the range where alloy system failure occurs coincident. This proves that the mechanical properties of nanopolycrystalline Cu–Sn alloy are closely related to the changes in the lattices
Summary
Due to the reliability demand of bearing parts, which require excellent comprehensive mechanical properties, it is valuable and practical to research the influencing factors of strength, ductility and elastic modulus for Cu–Sn alloy. Molecular dynamics simulation has become a useful tool to study the mechanical properties of nanopolycrystalline materials. Sara Fazeli [18] et al studied the effect of Cu content on the tensile mechanical properties of ternary NiTiCu alloy nanowires and the results showed that with the increase of copper content, the yield strength and Young’s modulus decrease. It is feasible to study the mechanical properties of nanopolycrystalline alloys through molecular dynamics simulation and may be suitable for nanopolycrystalline Cu–Sn alloys. This study explored the influencing factors of mechanical properties of nanopolycrystalline Cu–Sn alloy by the molecular dynamics method. Cu–Sn alloy and promote the development and application of Cu–Sn alloys
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