Abstract
Grinding at the nanometric level can be efficiently employed for the creation of surfaces with ultrahigh precision by removing a few atomic layers from the substrate. However, since measurements at this level are rather difficult, numerical investigation can be conducted in order to reveal the mechanisms of material removal during nanogrinding. In the present study, a Molecular Dynamics model with multiple abrasive grains is developed in order to determine the effect of spacing between the adjacent rows of abrasive grains and the effect of the rake angle of the abrasive grains on the grinding forces and temperatures, ground surface, and chip formation and also, subsurface damage of the substrate. Findings indicate that nanogrinding with abrasive grains situated in adjacent rows with spacing of 1 Å leads directly to a flat surface and the amount of material remaining between the rows of grains remains minimal for spacing values up to 5 Å. Moreover, higher negative rake angle of the grains leads to higher grinding forces and friction coefficient values over 1.0 for angles larger than −40°. At the same time, chip formation is suppressed and plastic deformation increases with larger negative rake angles, due to higher compressive action of the abrasive grains.
Highlights
Ultrahigh precision machining plays an increasingly important role in various contemporary high-end industries due to the necessity of fabricating parts or rendering features on various components with micrometer or nanometer dimensions
After the simulations were carried out, results regarding the first set of simulations will be Mdiicsrcomuascsheinde.s T20h2e0,e1f1f,e7c1t2 of spacing between the two rows of abrasive grains on the surface formed6 aofft1e5r the action of the abrasive grains and the produced chip can be observed in the snapshots of Figure 2. tIhne tahcitsiofnigoufreth, esnaabprasshiovtes gorfaitnhse alnasdt tthime pesrtoedpuocefdeacchhipccaasne bareeobesienrgveddeipnicttheedsnfoarpcsahsoets ostfaFritginugrefo2r
The chip produced by the material removal from both rows of abrasive grains is still common until spacing value exceeds 7a
Summary
Ultrahigh precision machining plays an increasingly important role in various contemporary high-end industries due to the necessity of fabricating parts or rendering features on various components with micrometer or nanometer dimensions. A Molecular Dynamics model with multiple abrasive grains is developed in order to determine the effect of spacing between the adjacent rows of abrasive grains and the effect of the rake angle of the abrasive grains on the grinding forces and temperatures, ground surface, and chip formation and subsurface damage of the substrate.
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