Molecular dynamics study of high temperature Ag-Cu-Sn liquid metal infiltration between Ag-Cu alloys：Influences of adsorption and dissolution

Abstract

Infiltration is the basic process underlying solder connections between alloys. In this study, molecular dynamics simulation was used to systematically investigate the infiltration process of Ag-Cu-Sn liquid metal between multi-formulations Ag-Cu alloys, along with the kinetic factors of the solid/liquid interface formation process. It was found that the infiltration velocity on the surface of the Cu-rich alloys is higher than that on the Ag-rich alloy surface. The difference in velocities originates from both adsorption and dissolution. The competitive interplay between these two factors directly impacts the bonding between solid and liquid atoms, consequently changing the ability of the interface to constrain the movement of liquid atoms. Analysis based on MKT suggests that infiltration along the three-phase line is primarily governed by molecular friction, whereas on the Ag90Cu10 surface, it is driven by the growth of adsorbed products. Additionally, the influence of solid/liquid interactions on wettability was also discussed.