Abstract

Silicon carbide (SiC) has been widely used in nuclear technology due to its excellent properties. In the irradiation environment, the energetic incident particles can cause the atoms in the material to deviate from the position of the crystal lattice, thereby producing the vacancies, interstitial atoms, anti-site atoms and other point defects. These defects will change the thermal properties of the material and degrade the service performance of the material. Therefore, in this work the equilibrium molecular dynamics method (Green-Kubo method) is used to study the effect of point defects on the heat transfer properties of cubic SiC (<i>β</i>-SiC or 3<i>C</i>-SiC) with the help of the Tersoff-type potential. The point defects considered include Si interstitial atoms (Si<sub>I</sub>), Si vacancies (Si<sub>V</sub>), Si anti-site atoms (Si<sub>C</sub>), C interstitial atoms (C<sub>I</sub>), C vacancies (C<sub>V</sub>) and C anti-site atoms (C<sub>Si</sub>). It is found that the thermal conductivity (<i>λ</i>) decreases with the increase of the point defect concentration (<i>c</i>). The excessive thermal resistance (Δ<i>R</i> = <i>R</i><sub>defect </sub>– <i>R</i><sub>perfect</sub>, <i>R</i> = 1/<i>λ</i>, <i>R</i><sub>defect</sub> is the thermal resistance of the defective material, and <i>R</i><sub>perfect</sub> is the thermal resistivity of the material without defects) has a linear relation with the concentration of point defects in the considered range (0.2%–1.6%), and its slope is the thermal resistivity coefficient. It can be found that the thermal resistivity coefficient of vacancy and interstitial atoms are higher than that of anti-site atoms; the thermal resistivity coefficient of point defects at high temperature is higher than at low temperature; the thermal resistivity coefficient of Si vacancies and Si interstitial atoms are higher than that of C vacancies and C interstitial atoms. These results are helpful in predicting the thermal conductivity of silicon carbide under irradiation and controlling the thermal conductivity of silicon carbide.

Highlights

  • the energetic incident particles can cause the atoms in the material to deviate from the position

  • These defects will change the thermal properties of the material

  • It is found that the thermal conductivity

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Summary

Introduction

石墨烯/碳化硅异质界面热学特性的分子动力学模拟 Thermal property of graphene/silicon carbide heterostructure by molecular dynamics simulation 物理学报. 交联对硅橡胶热导率影响的分子动力学模拟 Molecular dynamics simulation of effect of crosslinking on thermal conductivity of silicone rubber 物理学报. 因此, 本文利用平衡分子动力学方法 (Green-Kubo 方法) 采用 Tersoff 型势函数研 究了点缺陷对立方碳化硅 (b-SiC 或 3C-SiC) 热传导性能的影响规律. 研究过程中考虑的点缺陷包括: Si 间隙 原子 (SiI)、Si 空位 (SiV)、Si 错位原子 (SiC)、C 间隙原子 (CI)、C 空位 (CV) 和 C 错位原子 (CSi). 关键词:碳化硅, 热导率, 分子动力学, 点缺陷 PACS:65.40.–b, 61.72.J–, 02.70.Ns

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