Abstract

The boiling process of argon above solid copper substrates with different surface roughness levels are investigated using molecular dynamics simulations. The randomly distributed rough surface profiles are generated by a multivariable Weierstrass-Mandelbrot function. With the application of the thermostat on the solid atoms, bubble nucleated at the solid-liquid interface after experiencing a period of evaporation process. Afterwards, the bubble grew into vapor film and pushed the bulk liquid cluster away from the solid wall. It was found that the rough structures advanced the boiling inception time and increased the evaporation mass flux. The existence of cavities is favorable for bubble nuclei appearance. Besides, the heat transfer between the solid and fluid atoms become more efficient with the help of surface nanostructures. The energy exchange rate is further improved with higher surface roughness.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.