Molecular dynamics simulations of nanometric cutting of single crystal copper sheets using a diamond tool

Abstract

Nanometric cutting of a single crystal copper workpiece of different crystallographic orientations by a stiff cylindrical cubic diamond tool has been investigated by MD simulations using the freeware LAMMPS. The chip evolves during the cutting process and forms depending on crystal orientation, cutting velocity and tool geometry. It was found that no significant difference in the cutting force magnitude was observed for different crystallographic orientations despite significant differences in deformation patterns. After tool passage the surface is smooth and no elastic recovery was detected. Instead, a grain structure with areas surrounded by dislocation clusters form in the tool wake. Increasing the cutting velocity promotes chip formation and chip folding, thus increasing the chip thickness.