Molecular dynamics simulations of low-energy argon ion sputtering of copper clusters on polyethylene surfaces

Abstract

The normal bombardment of the targets consisted of single 13-, 27- or 39-atom copper cluster on a surface of polyethylene by Ar ions with energies of 100, 200 and 400eV is examined using molecular dynamics simulation incorporating long-range many-body covalent bonding potential for hydrocarbons and a potential based on a embedded atom model for copper. Sputtering yield and its dependence on the energy of bombarding ion and size of the pre-deposited copper cluster are discussed.