Molecular dynamics simulation of tin whisker growth in three-point bending copper-tin coating under multi-field coupling

Abstract

The tin whisker growth of Sn/Cu/Sn coating and the interface stress change under three-point bending are simulated by using the modified embedded atomic potential under different temperatures and indenter velocities. The interface stress in each region is generally on the rise trend during the bending process of the coating. Tin whisker growth is a dynamic process of stress accumulation and release in the coating. There is a critical indenter speed value during the period of 0.5–1 Å /ps, which makes the stress balance appear in the tensile area, thereby inhibiting the precipitation of tin atoms.