Abstract
This article investigates the nano-milling of multi-grooves on single crystalline copper. To explore the material removal mechanisms, molecular dynamics (MD) simulations were carried on both sequential and simultaneous nano-milling processes. It was found that to obtain quality grooves; a simultaneous multi-grooving requires a larger wall thickness between two adjacent grooves. Under sequential nano-millings or a simultaneous nano-milling with same rotational direction of the tools, the minimum wall thickness can be identified by residual stress distribution analysis. Under a simultaneous nano-milling with opposite rotational direction of the tools, this requirement of minimum wall thickness is better identified by strain rate distribution analysis. Overall, the simultaneous nano-milling with opposite rotational direction of the tools gives the best groove quality. A detailed machinability analysis showed that the groove quality by nano-milling can be improved by increasing the depth of cut and wall thickness between two adjacent grooves.
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