Molecular dynamics simulation of effects of twin interfaces on Cu/Ni multilayers

Abstract

We perform molecular dynamics simulation of the indentation on pure Cu and Ni films and Cu/Ni multilayered films with a cylindrical indenter, aimed to investigate the effects of the cubic-on-cubic interface and hetero-twin interface on their mechanical properties. We also investigate systematically the formation of twin boundary in the pure metals and the effects of the cubic-on-cubic and hetero-twin interface on mechanical properties of the multilayers. We find that the slip of the horizontal stacking fault can release the internal stress, resulting in insignificant strengthening. The change in the crystal orientation by horizontal movement of the atoms in a layer-by-layer manner is found to initiate the movement of twin boundary, and the hetero-twin interface is beneficial to the hardening of multilayers. Moreover, we also find that increasing number of hetero-twin interfaces can harden the Cu/Ni multilayers.