Molecular dynamics simulation of displacement damage in 6H-SiC

Abstract

ABSTRACTAs a new generation of low-loss components, 6H-SiC is widely used in optoelectronic devices, electronic devices and other fields, especially in high temperature and strong radiation environment. Radiation will lead to a great large of defects generated in the material, then forming permanent displacement damage which will result in performance down or failure. In this paper, the molecular dynamics method was used to study the spatial distribution of defects and the effect of temperature and PKA energy on the various properties of the point defects. The main contributions were the evolution of defects in 6H-SiC crystal, the influence of PKA energy and temperature on the defect distribution and the number of point defect. In this paper, the spatial distribution of point defects in 6H-SiC crystal after PKA incidence was obtained, the recombination rate under four kinds of energy PKA was calculated, and the effect of temperature and incident PKA energy on the number of defects, the rate of the vacancy cluster and the rate of vacancy defects at steady state were investigated. The results show that the number of defects at steady-state increases linearly with the increase of incident PKA energy, the effect of temperature and energy on defects producing and the rate of clusters are insignificant.