Abstract
In this paper, we present a molecular dynamics (MD) study on a low-energy ion implantation process for nanoscale CMOS (Complementary Metal Oxide Semiconductor) processes. To model the profiles of interstitials and vacancies, the recoil interaction approximation (RIA) was employed, while the kinetic Monte Carlo (KMC) approach was used for modeling the dynamic annealing effect between cascades. The simulation results performed for as-implanted boron profiles were compared with the results of the binary collision approximation (BCA) calculation by UT-MARLOWE as well as with the experimental SIMS data. The simulation revealed that the dynamic annealing effect between cascades is essential for the accurate estimation of defect distribution as well as as-implanted ion distribution. The dynamic annealing effect was carefully investigated for a case of boron implantation with an ion implantation energy of 2 keV, doses of 1×1014 ions/cm2 and 1×1015 ions/cm2, and a dose rate of 1×1012 ions/cm2·s.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
