Molecular dynamics and experiment on ultraviolet-thermal curing abrasive tools for polishing microstructures

Abstract

To achieve efficient polishing of the microstructure array, a preparation method of the UV-thermal curing abrasive tools with diamond was proposed. The properties of the UV-thermal curing system were studied using molecular dynamics (MD) and experiments. The time, frequency, and pressure parameters of the UV-thermal curing abrasive tool were optimized by polishing the copper plate. MD simulation results show that increasing the temperature to 340 K can improve the blending compatibility. With the increase of the bisphenol A acrylate, the tensile property enhances from 16.38 MPa to 42.98 MPa, and the size shrinkage and mass loss weaken. The addition of diamond particles improves the anti-friction coefficient. Finally, the microstructure is polished twice under the polishing pressure of 300 N and 200 N, resulting in a roughness of Ra61nm on the upper surface and Ra105nm on the lower surface. This study can be used to guide the preparation and application of UV-thermal curing abrasive tools for polishing microstructure.