Moisture-induced stresses in engineered wood flooring with OSB substrate

Abstract

Engineered wood flooring (EWF) is a multilayer composite flooring product. The cross layered structure is designed to give good dimensional stability to the EWF under changing environmental conditions. However, during winter season in North America, the indoor relative humidity could decrease dramatically and generate an important cupping deformation. The main objective of this study was to characterize the interlaminar stresses (σ 33, σ 13 and σ 23) distribution at free-edges in EWF made with an OSB substrate. A three-dimensional (3D) finite element model was used to predict the cupping deformation and to characterize stresses developed in the EWF. The finite element model is based on an unsteady-state moisture transfer equation, a mechanical equilibrium equation and an elastic constitutive law. The physical and mechanical properties of OSB substrate were experimentally determined as a function of the density and moisture content. The simulated EWF deformations were compared against the laboratory observations. For both simulation and experimental results, the cupping deformation of EWF was induced by varying the ambient relative humidity from 50 to 20% at 20°C. A good agreement has been found between the numerical and experimental EWF cupping deformation. The stress distribution fields generated by the model correspond to the delaminations observed on the OSB substrate in the climate room. Delamination in EWF can occur principally under the action of the tension stress or a combination of tension and shear stresses. Finally, simulated results show that the levels of interlaminar stresses are maximal near the free-edges of EWF strips.