Moisture effect on thermal conductivity of some major elements of a typical Libyan house envelope

Abstract

The thermal conductivity and the assessment of moisture effect on building materials are essential for the calculation of the thermal loads on houses. Building materials such as simple units e.g. bricks, tiles, cement plasters, mortar and ground soils are investigated in this work. In the eastern coastal province of Libya, old buildings have thick walls (more than 50 cm thick made of mixed clay and stones) and consequently have good capacitive insulation. On the other hand, the relatively new houses have thin walls and need the addition of insulating materials. Unfortunately, these new houses were constructed without having enough technical data on the thermal properties of building materials and thermal loads were not considered. This leads to uncomfortable living conditions during hot and humid summers and cold and wet winters. This article reports the thermal conductivity values of three types of locally produced building materials used in the construction of a typical Libyan house envelope and gives suggestions to improve the thermal performance of such envelopes. The transient plane source technique (TPS) is used to measure the thermal conductivity of these materials at an average room temperature of 25 °C. The TPS technique uses a resistive heater pattern (TPS element) that is cut from a thin sheet of metal and covered on both sides with thin layers of an insulating material. The TPS element/sensor is used both as a heat source and as a temperature sensor. This technique has the dual advantage of short measuring time and low temperature rise (around 1 K) across the sample. This will prevent a non-uniform moisture distribution that may arise when the temperature difference across the wet samples is maintained for a long time. In addition, the flat thin shape of the TPS element substantially reduces the contact resistance between the sample and the sensor. More details about the TPS technique are included.