Abstract
Thermal interface materials (TIMs) with excellent comprehensive performance which own high thermal conductivity, good electrical insulation and mechanical properties have triggered considerable interests in addressing the interfacial transfer issue for the state-of-the-art electronic devices. Herein, a new method was developed to covalently bonded crosslink boron nitride (BN) and reduced graphene oxide (rGO) by the chemical surface modification technology and chemical reaction between the erent functional groups. Meanwhile, the integrated three-dimensional (3D) networks of BN-rGO filler and natural rubber (NR) matrix were fabricated by the ice-templated method. After vulcanization, the boron nitride- reduced graphene oxide/ natural rubber (BN-rGO/NR) TIMs owned good comprehensive performance. As a result, the highest through-plane thermal conductivity could reach 1.04 W m−1 K−1 and also possessed sensitive response ability of heat flux. Importantly, the approach provided a valuable guidance to design TIMs with excellent comprehensive properties and owned promising applications in the thermal management of electronics.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Composites Part A: Applied Science and Manufacturing
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
