Abstract
The future development of high performance power electronics will rely increasingly on system level integration, where semiconductor devices are co-packaged with other active and passive components (e.g., gate-drivers, filter capacitors and inductors) into a power module. In view of the widespread electrification of pivotal elements of the energy generation and distribution infrastructure (e.g., smart-grids, electric aircraft, electric vehicles), modularity is also increasingly gaining importance as a means of enhancing overall system performance and reducing long-term maintenance costs. This paper focuses on the development of a highly integrated 3-to-1 phase matrix converter for avionic applications. It proposes an integration approach which enhances the volumetric and gravimetric power handling capability, with enhanced electro-magnetic and electro-thermal performance as compared with established solutions. Maintenance is also simplified by the modular assembly approach.
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