Abstract

Infrared scene projectors (IRSPs) are a critical laboratory tool for setup, calibration, and testing of infrared sensors. Infrared light emitting diode projectors are evolving to handle higher resolution, faster frame rates, and higher cooling power. New cryogenic packaging that can support these advanced features is needed. This paper describes a new cryogenic package design that enables higher resolutions and faster frame rates. The resulting modifications to the IRSP system hardware are described.

Highlights

  • Infrared scene projectors (IRSPs) display radiometric video scenery in the infrared (IR) spectrum

  • This paper describes a new cryogenic package design that enables higher resolutions and faster frame rates

  • The Infrared Light Emitting Diode(IRLED) used in this work is composed of an array of Gallium-Antimonide (GaSb) super-lattice light emitting diodes (SLEDs), a Silicon Complementary Metal Oxide Semiconductor (CMOS) Read-In Integrated Circuit (RIIC), and close support electronics (CSE) that converts video scenery data into the correct format to be displayed on the SLEDs array

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Summary

Introduction

Infrared scene projectors (IRSPs) display radiometric video scenery in the infrared (IR) spectrum. The Infrared Light Emitting Diode(IRLED) used in this work is composed of an array of Gallium-Antimonide (GaSb) super-lattice light emitting diodes (SLEDs), a Silicon Complementary Metal Oxide Semiconductor (CMOS) Read-In Integrated Circuit (RIIC), and close support electronics (CSE) that converts video scenery data into the correct format to be displayed on the SLEDs array. Combined together, these devices form an infrared micro-display. The first HDILED array was mounted to a hybrid carrier PCB designed to fit in the original Dewar [3]

New Cryogenic Package Design
Vacuum Chamber
Electronics Development
Carrier Board
Mogh Board
Conclusions

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