Abstract
A modified thin film processing sequence in which tantalum nitride (TA/sub 2/N) resistors are stabilized prior to chromium/gold (Cr/Au) evaporation was investigated, and the effects of subsequent processing on unstabilized Cr/Au films were determined. Thin films evaporated using the modified process yielded results similar to those of films evaporated using the standard processing techniques. Work on the modified process was discontinued because of some metallization adhesion failures at the Cr/Au-to-Ta/sub 2/N interface, higher contact resistance, and the additional steps required in processing.
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