Abstract
In this article, initially, the TCTCl (DiPrAEA)2 ligand was synthesized and characterized by Fourier transform infrared (FT‐IR), X‐ray crystallography, 1H‐ and 13C‐NMR spectroscopy, and elemental analysis. The crystallographic structure data for the ligand has been deposited at the Cambridge Crystallographic Data Centre (CCDC No. 2282732). Then, using of this novel multidentate ligand, a novel and stable copper (II) nanocatalyst complex was synthesized by anchoring copper (II) acetate onto the core‐shell surface (Fe3O4@SiO2) via the novel multidentate ligand TCTCl (DiPrAEA)2. The successful synthesis of the Fe3O4@SiO2‐NH‐TCT (DiPrAEA)2‐Cu (II) nanocatalyst was confirmed by employing physicochemical techniques such as FT‐IR, X‐ray diffraction, ultraviolet‐visible, thermogravimetric analysis, X‐ray photoelectron spectroscopy, Brunauer–Emmett–Teller, energy‐dispersive X‐ray, dynamic light scattering, inductively coupled plasma, transmission electron microscopy, field emission scanning electron microscopy, and vibrating sample magnetometer. Subsequently, this novel copper (II) nanomagnetic complex was evaluated as an efficient, reusable, and novel catalyst for the formation of C‐N bonds via the Ullmann coupling reaction of aryl halides and nitrogen‐containing compounds. The influence of this novel TCTCl (DiPrAEA)2 ligand on the reactivity and stability of the nanomagnetic copper complex was visible in the Ullmann reaction, which resulted in rapid reaction times and excellent yields, and seven times reusability.
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