Modification of film structure by plasma potential control using triode high power pulsed magnetron sputtering

Abstract

We have designed a new triode configuration in a magnetron sputtering apparatus to control the plasma potential of the discharge. An additional chimney electrode was introduced above the conventional sputter gun to apply a positive voltage. The discharge power was provided by a pulse power source to achieve high power pulsed magnetron sputtering operation. We confirmed that the plasma potential increased with increasing positive electrode voltage. Copper films with substantially flatter surfaces could be obtained on a water-cooled and electrically grounded substrate at an Ar gas pressure of 5 Pa.