Modification of bonding properties and microstructure of resin-cement interface by coupling agents

Abstract

To solve the problem of organic-inorganic light conductive composite interface features, transparent resin and cement matrix were used as carriers to further study features of the organic-inorganic interface formed by transparent resin and cement matrix and the interface modification of the coupling agent. The bond strength, micro-hardness, microstructure and surface morphology of a resin light conductive cementitious materials (RLCCM) interface were evaluated by tests of tensile and oblique shear, micro-hardness, environmental scanning electron microscopy, and atomic force microscope. The results show that the silane A-151 and aluminate coupling agent could significantly improve interface bond properties of RLCCM. At 7 d, the interface tensile bond strength of the silane A-151 and aluminate coupling agent increased by 117 and 105%, respectively. At 28 d, strength on average increased by 73%. At 7 d, interface shear strength the silane A-151 and aluminate coupling agent of 45° increased by 43 and 53%, respectively, At 28 d, strength on average increased by 40%. The transparent resin performance weakened region thickness up to 100 μm; the hardness of the transparent resin in the transition region was increased by 19.6 and 39.9%, respectively. Silane coupling agent A-151 and cement hydration products formed flat spherical particles with diameter of approximately 78 nm, and these particles mosaicked and fused in the surface of the hydrate; therefore, the surface became denser and smoother.