Abstract
AbstractThis study focuses on the modification of starch using cold plasma (CP) for 0, 30, 60, and 90 seconds. The prepared films are characterized (i.e., thickness, water vapor permeability, intrinsic viscosity, solubility in water, and moisture absorption). The thickness, water vapor permeability (WVP), intrinsic viscosity, solubility in water (SW), moisture absorption (MA), and roughness of the modified starch films increases with longer plasma‐processing time (PPT). Conversely, the contact angle and density of the films decreases. However, there are no significant changes observed in the moisture content and UV–Vis spectrum of the cold plasma‐irradiated starch (CPS) films. The CP treatment has some effects on the mechanical properties of the films, such as elongation at break and tensile energy to break, but the tensile strength remains unaffected by PPT. Additionally, CP has a significant impact on the visual properties of CPS films, with increased lightness and white index with longer PPT. Most of the observed characteristics are attributed to physical changes in the starch structure caused by etching. Overall, CP is considered a green, and easy for modifying starch‐based packaging materials. However, it is not an effective method for reducing the sensitivity of the films to moisture at the applied PPT.
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