Abstract

Modern Applied Science, Vol. 2, No. 1, January 2008, all in one file

Highlights

  • The investigations of channel dynamics, which are generated due to Mobile Station (MS) movement, on future generation receivers are crucial, as it influence both the spatial and temporal channel characteristics (Durrani 2006).Since many years, extensive studies have been carried out in order to gain more profound knowledge about the propagation channel characteristics (Bultitude 1989, Zhao 2002)

  • This paper shows how to generate a birth-death dynamic channel in a laboratory, explain different parameters that are behind or generated by the birth-death behaviour, investigates the effect of the birth-death model on WCDMA receivers, shows how important to pay attention to the channel dynamics by comparing it with static channel behaviour, and shows the effect of different parameters related to the birth-death channel on WCDMA receivers

  • The effect of birth-death path dynamic behaviour compared to a static one in a propagation channel, on a WCDMA receiver can be shown by the bit error rate analysis at the output of the receiver

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Summary

Introduction

The investigations of channel dynamics, which are generated due to Mobile Station (MS) movement, on future generation receivers are crucial, as it influence both the spatial and temporal channel characteristics (Durrani 2006).Since many years, extensive studies have been carried out in order to gain more profound knowledge about the propagation channel characteristics (Bultitude 1989, Zhao 2002). ; for some authors (Zwick 2000, Nielson 2001, Chiao 2003) channel dynamics are not referred to the fast behaviour of the faded envelope, they are referred to the dynamic change of the delay of each received reflected and scattered paths. The channel dynamics due to variable time delay path behaviour appears to be firstly studied by (Zwick 2000) through a ray tracing model and Nielsen (Nielsen 2001) through a temporal domain model. A large amount of study shows that the cracking of semi-rigid base courses is induced by thermal shrinkage and dry shrinkage of semi-rigid materials (Zhang, 1991, pp.). Thermal shrinkage and dry shrinkage of semi-rigid base courses will cause shrinkage stress, and once the shrinkage stress exceeds the tensile strength of the semi-rigid materials, cracks will come into being (Zheng and Yang, 2003). Basic assumptions in the calculation (1) While subbase courses and base courses bring relative displacement in horizontal direction, the friction stress of a certain point on the interface is directly proportional to the horizontal displacement of the point (Wang, 1997), as is shown in Eq (1):

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