Abstract

Impurity incorporation during vapor-phase epitaxy on stepped surfaces was modeled by classifying rate-limiting processes into i) surface diffusion, ii) step kinetics, and iii) segregation. Examples were shown for i) desorption-limited Al incorporation during chemical vapor deposition (CVD) of (0001) SiC, ii) preferential desorption of C atoms from kinks during CVD of Al-doped (000-1) SiC, and iii) segregation-limited C incorporation during metalorganic vapor-phase epitaxy of (0001), (000-1), and (10-10) GaN.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call