Modelling the impact of refinishing processes on COTS components for use in aerospace applications

Abstract

Commercial off the shelf components (COTS) are being adopted by electronic equipment manufacturers for use in aerospace applications. To ensure that these components meet the quality and reliability standards, refinishing processes, such as hot solder dip and laser deballing/reballing, are used to replace component lead-free solder terminations with tin–lead solder. These processes provide a risk mitigation strategy against tin whiskers induced short circuit failures. Being an additional step to the subsequent PCB assembly process it is important that this additional process does not impose significant thermo-mechanical stress which can impact subsequent reliability. As part of a major study in collaboration with industry partners, process models have been developed to predict the thermo-mechanical behaviour of components when subjected to the refinishing process. This paper details the techniques used to provide model input data (e.g., process parameters and package geometric/materials data) as well as the development and application of these modelling techniques to the refinishing process.