Abstract
The principles of molecular modelling have been combined with Group Interaction Modelling (GIM) for the prediction of properties of thermoset/thermoplastic resins. The glass transition temperature of the systems was modelled and thermomechanical properties of epoxy resin polyether sulphone blends were discussed. As a result a full envelope of Dynamic Mechanical Thermal Analysis Relaxation (DMTA) curve for wet and dry material was predicted. Differential Scanning Calorimetry (DSC) and DMTA experimental methods were used to validate the modelling results.
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