Abstract

The main purpose of this paper is to present the methodology for calculating the electromagnetic behaviour of real integrated circuit (IC) parts using a no-mesh local Finite Differential Method (FDM). Furthermore, the comparison of computational results and measurements is presented. All considerations are based on typical long transmission lines (TLs) in modern ICs. The obtained results have been analysed in detail and compared with measured values. The measurement data are de-embedded using the test board model. This problem is illustrated in this paper based on a practical example of the Multi-Conductor Transmission Lines test structure whose electrical responses to various excitations are presented and analysed in detail.

Highlights

  • Modelling and analysis of the electromagnetic phenomena occurring in the integrated circuits (ICs) are essential takes for a reliable design of semiconductor microelectronic systems

  • Experimental verification of the models and numerical simulations. The conclusions of their accomplishment are presented in the paper based on an example of the designed Application Specific Integrated Circuits (ASICs) test structure, and the Printed Circuit Board (PCB) test board are outlined below

  • We have developed a dedicated tool for the generation of the distributed electromagnetic models using the set of ODEs as part of our research work

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Summary

INTRODUCTION

Modelling and analysis of the electromagnetic phenomena occurring in the integrated circuits (ICs) are essential takes for a reliable design of semiconductor microelectronic systems. The pointwise Pn enforced voltage Vforced condition is modelled using the curvilinear integral of an electric vector field E evaluated along the shortest path Γn,..., Γ1 connecting the closest points from the polarised mesh point Pn to the nearest point P1 on the bottom ground plate, see Fig. 1. This integral equation can be approximated using the trapezoidal rule. The surface (and pointwise) Incident Wave Source Conditions are implemented only for the vertical electric field component (Ez) It can be modelled as a constant value.

NUMERICAL SOLUTION
TEST STRUCTURE
THE FINAL MCTL MODEL COMPARISON WITH REAL MEASUREMENTS
Findings
CONCLUSIONS
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