Abstract
In this paper, the effect of different thermocouple constructions on the hot spot temperature are investigated with a modelling approach to achieve more precise soldering profile acquisition and failure analysis at different reflow soldering heat transfer methods. The paper focuses on convection-based reflow and condensation based vapour phase soldering processes and related heat transfer coefficients. Different thermocouple constructions were investigated. The parameters include the ASTM-type (K, T, J), the length of uninsulated wire length, the insulation material (PFA, PVC, PTFE, woven glass-fibre), the insulation thickness and the diameter of the hot-spot. The physical dimensions were obtained with optical microscopy for validation. Finite element analysis was performed. After validation, the results show that most parameter and geometry changes – most significantly, the uninsulated wire end – can result in non-negligible timely differences in 100 ms range between different sensors, pointing to the requirement of sorting and pairing in a symmetric measurement environment. The results can be applied in a modern manufacturing environment and in future process modelling and evaluation tasks.
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