Abstract
This paper has three main purposes. The first is to investigate whether it is appropriate to use a planar thick-film thermoelectric sensor to monitor the temperature difference in a processor heat sink. The second is to compare the efficiency of two heat sink models. The third is to compare two kinds of sensors, differing in length. The model of the CPU heat sink sensor system was designed for numerical simulations. The relations between the CPU, heat sink, and the thermoelectric sensor were modelled because they are important for increasing the efficiency of fast processors without interfering with their internal structure. The heat sink was mounted on the top of the thermal model of a CPU (9.6 W). The plate fin and pin fin heat sinks were investigated. Two planar thermoelectric sensors were mounted parallel to the heat sink fins. These sensors monitored changes in the temperature difference between the CPU and the upper surface of the heat sink. The system was equipped with a cooling fan. Switching on the fan changed the thermal conditions (free or forced convection). The simulation results showed the temperature gradient appearing along the sensor for different heat sinks and under different thermal conditions. Comparison of the results obtained in the simulations of the CPU heat sink sensor systems proves that changes in the cooling conditions can cause a strong, step change in the response of the thermoelectric sensor. The results suggest that usage of the pin fin heat sink model is a better solution for free convection conditions. In the case of strong forced convection the heat sink type ceases to be significant.
Highlights
This paper is a part of research leading to developing a method to increase the efficiency of fast processors without interfering with their internal structure.Processing a large amount of data using the CPU leads to increases in its temperature
A series of simulations were made related to the temperature distribution in the CPU heat sink thermoelectric sensor system
The paper presents the specific application of thick-film thermocouples as a temperature difference sensor between the heat source (CPU) and cold side of the heat sink
Summary
This paper is a part of research leading to developing a method to increase the efficiency of fast processors without interfering with their internal structure. Processing a large amount of data using the CPU leads to increases in its temperature. The most common method is the combination of a passive heat sink and a fan with adjustable rotation speed [1]. In small devices, such as laptops, active heat sinks are implemented. Active heat sinks transport heat from the processor to the outside of the housing using a heat pipe [2]. Liquid cooling systems or Peltier modules (thermoelectric modules) are often used [3,4]
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