Abstract
Summary form only given. As the size of OEICs and the number of components increase, the issue of thermal interaction becomes increasingly important. To analyze the thermal interactions between multiple devices and its effect on laser performance, we have developed a lumped element circuit model which includes the electrical, optical, and thermal interaction effects. This model supplements the two dimensional finite-element non-isothermal simulations which provide a detailed insight into the internal thermal effects for individual structures, but offers a more practical method for modelling multiple devices in integrated optoelectronic circuits. This new lumped element model of laser diodes is directly derived from the carrier and the photon rate equations and the thermal conduction equation. >
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