Modeling the strain-rate dependence of fatigue life of hot-pressed silicon nitride

Abstract

This paper presents the results of a micromechanical model used to explain the strain-rate dependence of the compression fatigue lives of amorphous and crystalline grain boundary phase; denoted by ABP and CBP silicon nitrides, respectively. When the strain-rate is changed from 400 to 0.01/s, the fatigue lives of both materials, evaluated at a peak stress of 3.2 GPa, increased by more than two orders of magnitude (Sharma et al. (1996a,b)). The model is based on the dynamic and quasi-static microstructural damage mechanisms observed in both materials. The microstructure of ABP and CBP silicon nitrides is modeled as a simple composite in which silicon nitride grains are embedded in a continuous network of the grain boundary phase. Since the subsurface fatigue cracks in both materials nucleate mainly from the contact region between silicon nitride grains, contact stresses between adjacent silicon nitride grains are obtained, and the frequency dependence of the fatigue lives of ABP and CBP silicon nitrides is explained on the basis of the strain-rate sensitivity of the grain boundary phase.