Modeling the effect of recovery on the room temperature fracture strength of W-0.01% K (non-sag) wire

Abstract

The room temperature (RT) strength and ductility of potassium doped tungsten wire (i.e. non-sag) varies significantly with annealing conditions. Wire, in an as-drawn condition, exhibits limited ductility ( 1,100 C) of drawn, doped tungsten wire. The result is of interest to those who specify doped tungsten wire for applications where strength retention, after thermal processing (i.e. brazing, annealing, metal-matrix/metal-fiber composites), is important.