Abstract

The kinetics of solid phase epitaxy (SPE) in surface amorphous silicon layers doped with a single arsenic profile have been examined in relation to the generalized Fermi level shifting model of the SPE growth process. The model has been extended to include passivation by hydrogen of the defects responsible for SPE and∕or passivation of dopant atoms. A previous study has suggested that the asymmetry between the dopant-enhanced SPE rate and the arsenic concentration profile is due to the infiltration of hydrogen from the surface oxide. Theoretical calculations of the dopant-enhanced SPE rate compare well with experiment if it is assumed that the indiffusing hydrogen passivates some of the SPE defects and∕or some of the dopant atoms.

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