Abstract
The kinetics of helium bubble growth during annealing of unstressed and stressed metals is modeled. Growth in the matrix, on grain boundaries as well as on triple grain junctions is considered. A coalescence model is developed for the description of helium bubble growth by volume and surface diffusion. The dependence of growth on the location of the bubbles in the microstructure is discussed. An applied tensile stress has been observed to accelerate bubble growth on grain boundaries and on triple grain junctions [1]. A theoretical model of the influence of stress-induced grain boundary sliding on bubble growth on triple grain junctions in a stressed metal due to bubble sweeping by moving dislocations during creep is suggested. The time-dependent bubble size distribution function is discussed for different mechanisms and paths of bubble migration. The time dependences of the number density and mean radius of bubbles in unstressed metal is derived. The present theoretical model is compared with experimental TEM results for an Fe 17Cr 17Ni alloy which was cyclotron-injected with 160 appm helium and annealed at 1023 K for times up to 1.74 Ms (482 h), due to Braski [J. Nucl. Mater. 83 (1979) 265].
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