Modeling the chemorheology of thermosetting resins during processing

Abstract

AbstractThe curing conditions determine the rheological changes in the resin during the lamination of prepregs into multilayered circuit boards. In order to specify the optimum curing conditions during lamination, it is necessary to understand the rheology of the resin as it cures. In this study, the chemorheological behavior of two commercial epoxy resins and one cyanate‐based resin was characterized using an engineering model for the resin viscosity. A linear regression technique was used to evaluate the model parameters from the conditions at the minimum viscosity obtained during resin cures at constant heating rates. The technique was extended to predict the minimum viscosities reached by the resins when subjected to temperature conditions commonly encountered during lamination. The utility of the technique for specifying the curing conditions necessary to have a desired resin flow during lamination and for selecting resin systems for lamination based upon chemorheology has been demonstrated.