Year-end Sale % OFF 
Abstract
AbstractThe ongoing miniaturization and environmental trends in microelectronics recently turn the attention to new materials the properties of which still have to be studied. Of fundamental importance for material properties is the temporal development of the microstructure which can experimentally be observed in several solder alloys. Starting with a detailed overview on coarsening phenomena and intermetallic growth as observed in lead‐free solders we concentrate on the description of nucleation and spinodal decomposition in these alloys. An extended diffusion equation of the phase field type is presented in which all required material parameters are determined either from the literature / databases or from calculations based on the Embedded‐Atom Method (EAM). We will restrict to the one dimensional case of diffusion and consider as an example the FCC‐structured lead‐free binary solder alloy Ag‐Cu. Furthermore a numerical study is performed in order to arrive at a quantitative description of temporal micromorphological development. (© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
