Modeling on the Flatness of Silicon Wafers Ground by the Grind-polishing Wheel

Abstract

The grind-polishing wheel is a new non-woven structure grinding tool with low elastic modulus and ultra-fine abrasive grains, which can obtain high surface/sub-surface quality ground silicon wafers. To obtain high-shape flatness during grinding with the grind-polishing wheel, a prediction model of the ground silicon wafers’ flatness considering the elastic modulus of the wheel, processing parameters, and abrasive grain size is developed. The grinding experiments under different speed ratios were conducted to verify the prediction model accuracy. It shows that the model can successfully predict the flatness of ground silicon wafers, and the error of the prediction model is less than 13%. The proposed model has some guiding significance for choosing the appropriate character of the grind-polishing wheel and grinding parameters to achieve desirable flatness for silicon wafers.