Abstract
Topography on the wafer surface has a great effect on chemical-mechanical polishing (CMP). In this paper, the performance of a CMP system is demonstrated to be approximately an linear time invariant (LTI) system. The effects of the low-frequency components and high-frequency components in the wafer topography on CMP process are investigated. The magnitude spectra and phase spectra of the system are obtained. A model for the effect of more complex topography is established based on Fourier transform. The influences of down force and pad stiffness on the performance of CMP with the same topography are also studied.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
