Abstract
In Extreme Ultraviolet Lithography, the electromagnetic modeling of the mask allows to determine the influence of the mask structure on the electromagnetic field. That makes it possible to take into account the presence of a defect modifying the multi-layer stack [1][2]. This paper presents the results of simulations, performed using a modal method, on the aerial image of the reflected intensity above the resist depending on the position of a defect with respect to an absorber pattern. These simulations allow to consider the influence of a defect not only on top of the structure but also everywhere inside the multilayer. The current method is the MMFE: Modal Method by Fourier Expansion. Modal methods are well adapted for EUV simulation mask due to materials and structure size.
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