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Abstract
To establish an efficient model for sonotrode system, a key part that continuously applies ultrasonic oscillation on metal foils to form solid state bond in ultrasonic consolidation equipment, this research presents modeling methods for sonotrode system. After an introduction to the construction of sonotrode system along with its operating principle, the transfer matrix method was adopted to build the model for the system consisting two ultrasonic transducers and one sonotrode. Simulation results of transfer matrix model were compared to that of finite element method. A prototype was fabricated and tested. A comparison of the resonance frequencies calculated by two modeling methods to the experimental result showed that the difference between transfer matrix model and prototype is 6.96% while the difference between finite element model and prototype is 9.26%. The proposed transfer matrix method is an efficient way to simulate dynamic performances for sonotrode system, which provide a better foundation for further optimization.
Highlights
Ultrasonic consolidation (UC) was developed based on metal ultrasonic additive manufacturing (UAM) which was mainly used for welding the congeneric metal and heterogeneous metal foil (Mariani and Ghassemieh, 2010; Jiao et al, 2019; Wang et al, 2019b)
This work aimed at an efficient dynamic model for a push-pull transducer adopted in high-power ultrasonic welding equipment and a transfer matrix model for its sonotrode was proposed
The reason for the error of transfer matrix method (TMM) can be attributed to the fact that the chamfering was regarded as a variable cross-section
Summary
Ultrasonic consolidation (UC) was developed based on metal ultrasonic additive manufacturing (UAM) which was mainly used for welding the congeneric metal and heterogeneous metal foil (Mariani and Ghassemieh, 2010; Jiao et al, 2019; Wang et al, 2019b). In UC process, high-power ultrasonic energy is transmitted to layers of metal foil through an ultrasonically vibrating sonotrode, pressed onto them, resulting in metallurgical bonding between atoms and interfaces of metal layers (Li and Soar, 2008; Li and Soar, 2009). This process avoids the high temperature needed for recrystallization, no protecting atmosphere is necessary for avoiding oxidization and smaller thermal deformation is arisen (Foster et al, 2013; Obielodan and Stucker, 2014).
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