Abstract
The impacts of multi-walled carbon nanotube (MWCNT) through-silicon vias (TSVs) on the impedance characteristics of power delivery networks (PDNs) are investigated in this paper. The equivalent circuit model of the TSV array in the PDN is given and validated. On the basis of the circuit model, the impedance performances of stacked chip-PDNs based on MWCNT TSVs are evaluated and analyzed.
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