Modeling of Physical and Chemical Processes of Anodic Bonding Technology

Abstract

Modeling ideas of physical and chemical processes when using an anodic bonding for materials connection are developed. The kinetics of a charge accumulation in an electrode region in a dielectric is considered. The thickness of a charge layer, electric fields strength and value of the ponderomotive pressure providing connection of materials are calculated. It is shown that the necessary ponderomotive pressure resulting in a dielectric-to-conductor seal is normally about ten MPa and the time required is about ten minutes.