Modeling of multilayered packages and boards using modal decomposition and finite difference methods

Abstract

Simultaneous switching noise (SSN) is a major signal integrity (SI) and electromagnetic interference (EMI) problem. SSN involves the interaction between the power/ground planes and the transmission lines. Through the power/ground planes, there can be noise coupling not only in the transversal direction between two planes, but also vertically from one plane pair to another through the apertures and via holes. In addition, transmission lines can excite the planes at return path disconti- nuities. Due to the large size of systems packaging, it is difficult to analyze such problems using full-wave simulators. We present an accurate and efficient modeling approach based on the finite difference method (FDM). Power/ground planes are modeled using FDM, while the transmission lines are incorporated using a modal decomposition method.