Abstract
Modeling of Heat Transfer for a Three-Dimensional Microelectromechanical Mirror Element with Consideration of Its Packaging Features
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https://doi.org/10.1134/s1063739723600292
Journal: Russian Microelectronics | Publication Date: Dec 1, 2023 |
Modeling of Heat Transfer for a Three-Dimensional Microelectromechanical Mirror Element with Consideration of Its Packaging Features
Join us for a 30 min session where you can share your feedback and ask us any queries you have