Abstract

The present work aims to modeling the thermal conductivity of fractured materials using homogenization-based analytical and pattern-based numerical methods. These materials are considered as a network of cracks distributed inside a solid matrix. Heat flow through such media is perturbed by the crack system. The problem of heat flow across a single crack is firstly investigated. The classical Eshelby's solution, extended to the thermal conduction problem of an ellipsoidal inclusion embedding in an infinite homogeneous matrix, gives an analytical solution of temperature discontinuity across a non-conducting penny-shaped crack. This solution is then validated by the numerical simulation based on the finite elements method. The numerical simulation allows analyzing the effect of crack conductivity. The problem of a single crack is then extended to a medium containing multiple cracks. Analytical estimations for effective thermal conductivity, that take into account the interaction between cracks and their spatial distribution, are developed for the case of non-conducting cracks. Pattern-based numerical method is then employed for both cases non-conducting and conducting cracks. In the case of non-conducting cracks, numerical and analytical methods, both account for the spatial distribution of the cracks, fit perfectly. In the case of conducting cracks, the numerical analyzing of crack conductivity effect shows that highly conducting cracks weakly affect heat flow and the effective thermal conductivity of fractured media.

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