Abstract
By applying a fully self-consistent solution of the Schrodinger-Poisson equations, a simple unified approach has been developed in order to study the gate current and gate capacitance of nanoscale-MOS structures with ultrathin dielectric layer. In this paper, the model has been employed to investigate various gate structure and material combinations, thereby demonstrating wide applicability of the present model in the design of nanoscale-MOSFET devices. The results obtained by applying the proposed model are in good agreement with experimental data and previous models in the literature. A new result concerning optimum nitrogen content in HfSiON high-k gate-dielectric structure reported in this paper requires experimental verification through device fabrication
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