Abstract
A void pattern in Sn4Ag0.5Cu solder joints under EM stressing was empirically obtained at the under bump metallization/intermetallic compound (UBM/IMC) interface. The pattern was associated with current crowding and consumption of the UBM layer. A kinetic model was employed and modified to describe the void propagation at UBM/IMC interface. Based on the continuity condition, the void growth velocity was calculated. The analytical results were in good agreement with the experimental data.
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