Abstract
An investigation of the corrosive and mechanical destruction of microelectronic objects such as multipurpose sensors and navigating devices used in the airspace industry in extreme conditions such as variable temperature, pressure and environmental composition is described. The appearance and growth of micro cracks and other defects in metallic parts and conductors of micro devices due to external actions are investigated. The structural features of defect‐testing devices improved on the basis of magnetic modulation sensitive iron elements are analyzed. Mathematical modeling for the most characteristic types of defects is performed and the forecast growth of defects within 6 % accuracy is achieved. Santrauka Atlikti mikroelektronikos objektų, eksploatuojamų ekstremaliomis sąlygomis bei esant kintamoms temperatūroms, slėgiui, darbinės aplinkos sudėčiai, irimo tyrimai, tarp jų – mikroįtrūkimų ir kitų defektų atsiradimo bei augimo mikroprietaisų metalinėse dalyse ir laidininkuose. Pagerinti prietaisų, gaminamų fero-moduliacinių elementų pagrindu ir skirtų mikroprietaisų defektų kontrolei, konstruktyviniai sprendimai. Sudarytas matematinis modelis, leidžiantis analizuoti būdingiausių rūšių defektus ir iki 6 % tikslumu prognozuoti defektų plitimą.
Highlights
Modern mechanical engineering and the production of aircraft are impossible without the use of electronic multipurpose sensors and navigating devices
An investigation of the corrosive and mechanical destruction of microelectronic objects such as multipurpose sensors and navigating devices used in the airspace industry in extreme conditions such as variable temperature, pressure and environmental composition is described
In previous research about the migration of atom clusters affected by the action of waves by means of an external physical field such as electro-sedimentation in a magnetic field, color pigment painting of optical glass with presence of colloidal metal particles in the paint, the absorption of nano-particles in a ceramic material matrix were demonstrated and research of stresses in the boards of micro modules caused by change in ambient pressure was carried out [3]
Summary
Modern mechanical engineering and the production of aircraft are impossible without the use of electronic multipurpose sensors and navigating devices. Devices are affected by great mechanical (vibration), physical (variable temperature and pressure), chemical (composition of environment), and other kinds of overloads. These factors can destroy electronic navigating devices in which defects in the form of micro cracks grow at a height of two or more kilometers from the Earth. Such cracks cannot be diagnosed by usual methods after flights. Electron transmission through a linear molecule, non-localized and localized electronic states at formation of a current, and organic molecular structures and compositions were investigated [5, 2]
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