Modeling of Crosstalk Induced Effects in Copper-Based Nanointerconnects: An ABCD Parameter Matrix-Based Approach

Abstract

Aggressive miniaturization has led to severe performance and signal integrity issues in copper-based interconnects in the nanometric regime. As a consequence, development of a proper analytical model for such interconnects is extremely important. In this work, an ABCD parameter matrix-based model is presented for fast and accurate estimation of crosstalk delay and noise for identically coupled copper-based nanointerconnect systems. Using the proposed model, the crosstalk delay and noise are estimated in copper based nanointerconnects for intermediate and global interconnects at the future integrated circuit technology nodes of 21 and 15 nm, respectively. Proposed model has been compared with SPICE and it is found that this model is almost 100% accurate as SPICE with respect to both the crosstalk delay as well as noise. Moreover, this model is as much as ~ 63 and ~ 155 times faster, respectively. From the crosstalk delay and noise analysis of unrepeated interconnects, it is observed that both delay and noise contribution will increase in scaled technology nodes. The same trend is observed also for the repeated interconnects. Also more number of repeaters and higher repeater sizes will be needed for delay minimization as we scale deeper. So as far as crosstalk induced effects are concerned, the copper interconnects will face a huge challenge to overcome in nanometer technology nodes.